Location: Sunnyvale, CA
Cap-Exempt H-1B Position — No lottery required
### **Minimum qualifications:** - Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience. - 8 years of experience in SI/PI design for chip/package or system PCB. - Experience in industry SI/PI modeling tool chains (e.g., HFSS, ADS, Sigrity, Siwave, etc.). ### **Preferred qualifications:** - Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field. - Experience with signal and power integrity with various high speed interconnects (e.g., HBMx, D2D, Ethernet, PCIe, etc.). - Experience with 2.5D/3D package design such as silicon interposer, silicon bridge, 3D die stacking. - Experience in co-design with chip top design, physical design, STA, package, system and validation teams. - Familiarity with the post SI test environment on memory or high speed serdes. - Excellent programming and data analysis skills with MATLAB, Python, C++, etc. to establish automation flows and data processing. ## **About the job** Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. As a Chip Package Signal Integrity/Power Integrity (SI/PI) Engineer, you will be responsible for the chip package design with signal/power integrity simulation and characterization in the chip, package and system level. Within a concurrent engineering environment, you will be the main part of a larger team with system architects, ASIC engineers, and other SI/PI engineers. You will work with multi cross-functional teams including chip design team, board design team, system design team as well as vendors. You will drive chip packaging signal and power implemen